ORIGINAL PHOENIX CONTACT MADE IN GERMANY
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A small 4 layer rigid-flex PCB made by Storm Circuit some days ago.
Rigid-Flex printed circuit boards are PCB boards using a combination of flexible and rigid board technologies.Many PCB designers do not know how to design the rigid-flex PCB ,or do not know what information you need to provide to PCB suppliers. We have a rigid-flex PCB design guide here,it may help you. PCB designers have to provide us the rigid part thickness and the flex part thickness, if there is a stackup to show each layer /PP thickness, that helps us much .
We made a lot of double sided rigid-flex PCB ,rigid part is usually 1.6mm, and flex part is 0.15-0.2mm.
Here is a 4 layer rigid-flex PCB. Flex part is in inner layers,thickness 0.12mm. rigid part 1.0mm.
Usually, 0.4mm pitch BGA circuit board is a bit difficult to do ,but we can make 0.4mm CSP, even,0.38mm CSP PCB ,we can make now.
0.4mm pitch BGA, means the space from BGA ball to another BGA ball is 0.4mm. This PCB is very small,10*10mm, and blind vias from L1-L2,it is 4 layer PCB ,0.6mm, half-hole plating.min hole 0.15mm,via in pad, 0.38mm pitch BGA. All the above features, we can see from below image.
Actually,we tried to made with board with standard blind PCB technology,but it is too difficult due to all difficult features put together.At last,we have to make this PCB with HDI technology and drill the blind vias with laser.that is very perfect.
We can make such HDI boards in 8-10 days.
Hello everyone,what is the biggest PCB you have seen?400*500mm?500*600mm?No.we made an 8 layer PCB which is much more than above size. that is really the biggest 8 layer PCB we made.
We know ,FPC can be very long ,but it is not too wide.FPC (flexible PCB) is made with polyimide material ,the material usually packed in a roll,so FPC usually can be very long .
How about rigid PCB,FR4 material?
The current biggest we made is 488*1072mm,this is an eight layer PCB with blind vias from L2-L8,high TG material (All 8 layer PCB ,we will use high TG material to do ).min hole 0.2mm,thickness 3.2mm.
We made a lot of such big FR4 boards,let us try your design.
We made a lot of such boards this year.below is an example what we did.
HDI board,there are four BGA area and three of four are 0.4mm pitch BGA with 0.1mm laser drilling.
Key feature:0.1mm drilling vias,blind vias,via in pad,Impedance control.0.4mm pitch BGA
This board is RF application ,the minimum trace is 3mil and the space is 3 mil too. But the most unusal is there are two cavities on board,the cavities are plated,it is not through from top to bottom .the depth is 10mil from top and plated .
The cavity is for bonding chips,the best surface finishing is ENEPIG for bonding.
Storm Circuit made lots of such RF application boards with high frequency material.
We made a lot of Rogers material+FR4 board,we call them mix stackup board. All are 6 layer PCB with special stackup. The stackup is as below. The stackup is making like an 8 layer PCB.
L1/L2 Core: RO 4350B 6.6mil
The PCB is 1.6mm, 1oz, blue solder mask,white silkscreen and immerion gold.Another special is the end lanch connector treatment. Trace at the connector is very small,we can not v-groove this board,otherwise,it will damage the trace and make short .
Pls see how to load the end lanch connector correclty.it is very strict,the board will not work if any damage.
how to load the end lanch connector.see below.
How we make assembly boards from your Altium or gerber file ? Below is a simple process.
1, We will export gerber file from your Altium .(Gerber file is preferred to us )
2,We will quote with your BOM and PCB file. any of your products photos will be helpful and 3D file.
3,PCB manufacturing following gerber. there are over 30 processes to do .drill -->plate. see our PCB process.WorkShop
4,In the meanwhile of PCB manufacturing,we will purchase components with your approved BOM.
5,PCB assembly,including SMT loading and Through hole soldering.
6,Final inspecting and photos to approve.
We know most of Al-substrate are single sided boards,but ,yes,there are always some exceptions. Some Al-substrate boards need to be doubles sided.We made a few of such boards,but designer always do not know what they want or what they designed.They do not know the Al-substrate is in the middle or at the bottom side .
Unlike FR4 PCB,any core-substrate boards have two types.One is sandwitch type as the Al-substrate is at the middle of board,like a sandwitch.Another is blind type.
See above for the Al-substrate boards stackup.All of metal-substrate boards like this too.Many double-sided metal-substrate boards used the first type--sandwitch .The metail is at the middle of the board.
Sandwtich Al board process is Al-susbtrate cutting --->drilling-->anodic oxidation--->stackup-->drilling, the last is the same as usual FR4 double layer board process.
Another type--blind type ,process is Al-susbtrate cutting --->drilling-->anodic oxidation
FR4 cutting --->drilling--->plating--->L2 layer---->stackup with above --->L1 layer--> the last is the same as FR4 double sided board process.
From the stackup,the hole is the main difference.The holes are through from TOP to Bottom side on sanswtch type.we can see holes easily. Blind type,the holes are not through,the bottom side is the Alminum.
So,when you design a double sided Al-substrate board,you can indicate it is Sandwitch or blind type or send us the stackup you want .
Chamfer,usually,we say "Chamfer" means golden fingers chamfer.The gold fingers are in the same straight line,there is no problem to do such chamfers. like below.
Our robot customer has a new design ,the Printed Circuit board in the design is round and it has a special shape to fit in the robot case. The chamfer is a circle and we must do it in the slots.